Wire Sawing

Wire sawing technology is a method for slicing and cutting silicon wafers, granite, marble, and other stone materials. In this process, a tensioned steel wire is passed through a slurry filled with silicon carbide abrasives, utilizing silicon carbide as the cutting medium between the workpiece and the wire. This technique is extensively used in the granite and stone processing industry, silicon wafer manufacturing, and the cutting of other crystalline materials.

Silicon carbide abrasives, suitable for both solar and semiconductor fields, are available for the wire sawing industry. These abrasives come in both green and black varieties and can be produced according to various standards such as ANSI, FEPA, or JIS. Additionally, adjustments in grain size distribution, surface treatments, and particle shapes can be made to meet specific cutting requirements, ensuring optimal performance for different applications.

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