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Green Silicon Carbide Micro Powder

Silk Road Abrasives’ Green Silicon Carbide is created from high-purity quartz sand and coke in an electric resistance furnace. It’s processed through ultra-fine grinding and classification to form micro-powders. With a greenish transparent color and a hexagonal α-type crystal structure, it boasts remarkable hardness, just below diamond. Its strong cutting ability and stable chemical properties make it ideal for grinding hard, brittle, and non-metallic materials like hard alloys, optical glass, ceramics, semiconductors, and more. Our Green Silicon Carbide particles and powders undergo diverse techniques to optimize their shape, surface, and density.

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Physical properties
Crystal Form： Hexagonal (Alpha SiC
Color： Green
Melting point:  Dissociates at Approx. 2500°C
True Density：  3.21 g/cm3
Hardness： Knoop (100): 2500 Mohs: 9.0+
Bulk density: depending on grain size
Typical chemical analysis
Silicon Carbide (SiC) 99.25%
Free Carbon (C） 0.05%
Silicon Dioxide (SiO2 ) 0.35%
Free Silicon (Si) 0.15%
Iron (Fe2 O3 ) 0.04%
Available grain sizes
(Average grain size)
ds50 value (µm)
FEPA Nr. Standard werte der Mikro-F-Reihe JIS Nr. FEPA Nr.
F230 53±3.0 #240 60±4.0 P240 58.5±2.0
F240 44.5±2.0 #280 52±3.0 P280 52.2±2.0
F280 36.5±1.5 #320 46±2.5 P320 46.2±1.5
F320 29.2±1.5 #360 40±2.0 P360 40.5±1.5
F360 22.8±1.5 #400 34±2.0 P400 35.0±1.5
F400 17.3±1.0 #500 28±2.0 P500 30.2±1.5
F500 12.8±1.0 #600 24±1.5 P600 25.8±1.0
F600 9.3±1.0 #700 21±1.3 P800 21.8±1.0
F800 6.5±1.0 #800 18±1.0 P1000 18.3±1.0
F1000 4.5±0.8 #1000 15.5±1.0 P1200 15.3±1.0
F1200 3.1±0.5 #1200 13.0±1.0
F1500 2.0±0.4 #1500 10.5±1.0
#2000 8.5±0.7
#2500 7.0±0.7
#3000 5.7±0.5
Other grain sizes can be customized and produced according to customer requirements.

Application areas (including but not limited to)

  • Semiconductor Processing

    This includes cutting, polishing, etching, chemical mechanical polishing, and packaging. Its exceptional hardness, cutting performance, and thermal conductivity make it a vital tool for achieving high-precision, high-performance semiconductor devices.

  • Ceramic Cutting and Precision Grinding Material

    Cutting and precision grinding materials for ceramics, hard alloys, new materials, and more.

  • Agate and High-end Jewelry Crafting

    Employed in cutting, carving, polishing, and finishing agate and other non-metal gemstones, enhancing their beauty and value.

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